1,Description:

1. Material: Tungsten copper alloy plates are composed of a mixture of tungsten and copper. The alloy combines the high strength and thermal conductivity of tungsten with the excellent electrical conductivity of copper.

2. Composition: Tungsten copper alloy plates typically have a tungsten content ranging from 70% to 90%, with the remaining portion being copper. Different compositions can be tailored to meet specific requirements for thermal and electrical properties.

3. High Strength: Tungsten copper alloy plates exhibit high strength and hardness, making them suitable for applications requiring resistance to wear, deformation, and high mechanical stresses.

4. Thermal Conductivity: Tungsten copper alloy plates possess good thermal conductivity, allowing for efficient heat dissipation and thermal management in various applications.

5. Electrical Conductivity: Tungsten copper alloy plates have excellent electrical conductivity, making them suitable for electrical and electronic applications that require both high strength and good electrical performance.

2,Specifications:

As a leading manufacturer of refractory metal products such as tungsten and molybdenum, our products are widely used in electronics&semiconductor, high temperature furnace industry, medical industry, glass&fiberglass industry and other fields. The main products include pure molybdenum, molybdenum alloy such as MoLa, TZM, and MoW; pure tungsten, tungsten alloy such us WCu, WNiFe, WNiCu and so on.