1,Description:

Material: Tungsten copper plates are composed of a composite material consisting of tungsten (W) and copper (Cu).

Density: The density of tungsten copper plates typically ranges from 14.5 to 16.5 grams per cubic centimeter (g/cm³), depending on the composition and manufacturing process.

Thermal Conductivity: Tungsten copper plates exhibit high thermal conductivity due to the presence of copper, which allows for efficient heat transfer within the material.

Electrical Conductivity: Copper is an excellent conductor of electricity, while tungsten has relatively lower electrical conductivity. The combination of these materials in tungsten copper plates provides moderate electrical conductivity.

Melting Point: Tungsten has a significantly higher melting point than copper. The specific melting point of tungsten copper plates may vary depending on the composition, but it generally falls within the range of 1,300 to 1,500 degrees Celsius (2,372 to 2,732 degrees Fahrenheit).

2,Specifications:

As a leading manufacturer of refractory metal products such as tungsten and molybdenum, our products are widely used in electronics&semiconductor, high temperature furnace industry, medical industry, glass&fiberglass industry and other fields. The main products include pure molybdenum, molybdenum alloy such as MoLa, TZM, and MoW; pure tungsten, tungsten alloy such us WCu, WNiFe, WNiCu and so on.